HELB schedules student outreach forums across universities and TVETs

HELB CEO Geoffrey Monari./Photo courtesy

The Higher Education Loans Board (HELB) has announced a series of campus engagement forums that will run between August 25 and 30 across different regions in Kenya. The exercise is aimed at reaching out to students in universities, technical training institutes and vocational colleges to provide information on loan services, scholarships and other forms of financial support.

According to the schedule, students in the Central Rift region will be engaged at Egerton University on August 25 and 26, Laikipia University on 27th and 28th, and Nyandarua University College on 29th. In the Western region, the tour will cover Bumbe Technical Training Institute on August 25, Bunyala Technical and Vocational College on 26th, Dr. Daniel Wako Murende TVC on 27th, Ebukanga TVC on 28th, and Luanda TVC on 29th.

In Nyanza, HELB officials will visit Kendege TVC on August 25, Mabera TVC on 26th, Rusinga TVC on 27th, Mbita TVC on 28th and Uriri TVC on 29th. The South Rift region will host engagements at Kimasian TTI on August 25, Kipsinende TTI on 26th, Belgut TTI on 27th, Kericho Town TTI on 28th and Total TVC on 29th August.

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The institutions covered in the North Rift, Central, and Upper Eastern regions include Dedan Kimathi University of Technology from August 26 to 29, University of Embu from 25th to 30th, Mount Kenya University from 25th to 29th and University of Eldoret from 25th to 29th.

The initiative is expected to give students a platform to raise concerns about loan applications, disbursement and repayment. It will also help those who have encountered challenges with the HELB system to receive guidance on available solutions. The board has in recent months expanded its channels for application and communication, with students now able to use the HELB portal, mobile application or USSD codes.

Stakeholder engagements held earlier this year revealed that many students struggle with the loan application process due to inadequate information, system errors or delayed communication. By taking its services directly to campuses, HELB aims to close these gaps and increase transparency in how funding decisions are made. The exercise is also expected to strengthen awareness on scholarships and appeal mechanisms available to students who may feel disadvantaged.

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For institutions in remote and underserved areas, the direct visits by HELB are likely to be particularly significant. Students in such colleges often face connectivity challenges and limited access to updated information. The forums will therefore provide an opportunity for them to receive first-hand guidance on how to benefit from government financial aid.

The campus tour is also timely, given that the loan application window for the current academic year remains open. With the August deadlines fast approaching, HELB is expected to use the engagements to urge eligible students to submit applications and avoid common mistakes that could delay processing.

By Benedict Aoya

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